Next-Generation High-density Capacitors Replacing MLCC — the "Rice of Semiconductors": ISC (Integrated Silicon Capacitor) and DTC (Deep Trench Capacitor)

 

high density capacitor : DTC and ISC type

[Posting: 2025.05.22]

High-capacitance capacitors such as ISC (Integrated Silicon Capacitor) and DTC (Deep Trench Capacitor) differ in their structural approaches, but both are optimized for applications that demand large capacitance—such as mobile, server, medical, and RF devices. They are now considered next-generation alternatives to MLCCs (Multi-Layer Ceramic Capacitors), offering superior performance in terms of stability under DC bias and temperature variation, excellent high-frequency response, thin and compact form factors, and enhanced durability and reliability. As a result, the transition toward ISC (or DTC) is accelerating.

As of 2025, ISC mass production at a density of 2000nF/mm² is underway, and by 2026–2027, it is expected to support capacitance levels of around 4000nF/mm². This will likely lead to growing demand for high-capacitance components and magnetic inductors required for voltage regulators in mobile and server platforms (Vtypical: 1.35V).

Currently, discrete capacitors dominate the market. In server applications, however, ISC is expected to be embedded within interposers, while in mobile devices, high-capacitance discrete components will continue to be used. As independent power supply to individual cores and stable voltage delivery become more critical—especially for achieving low power operation—these components are increasingly being recognized as essential for next-generation system architectures.

Integrated Silicon Capacitor (ISC) and DTC vs MLCC - Comprehensive Analysis (2025)

Overview and Market Analysis of ISC and DTC

Integrated Silicon Capacitors (ISC) and Direct Silicon Capacitors (DTC) are advanced capacitor technologies playing a crucial role in modern electronic devices. ISC is a high-density capacitor fabricated using semiconductor processes, characterized by excellent electrical stability and miniaturization. DTC, as an evolution of ISC, directly forms on the silicon substrate, offering ultra-fast response and superior high-frequency performance.

Technical Characteristics of ISC and DTC

ISC (Integrated Silicon Capacitor)

  • Manufacturing Process: Precision patterning on silicon substrate using semiconductor processes (Photolithography, Etching).

  • Electrical Properties: Maintains stable capacitance under DC bias and temperature variations.

  • Miniaturization: Ultra-thin (below 0.1mm) structure possible.

  • High-Frequency Performance: Optimal for high-frequency applications, including 5G communication, high-frequency filters, and AI servers.

DTC (Direct Silicon Capacitor)

  • Enhanced High-Frequency Performance: Formed directly on silicon for faster response.

  • Ultra-Compact and Integrated: Can be directly integrated into semiconductor packages.

  • Application Areas: RF modules, 5G communication, high-speed data transmission, satellite communications.

Technical Complexity

  • ISC: Requires advanced semiconductor processing (Photolithography, Etching) for precise manufacturing.

  • DTC: Direct patterning on silicon surface, requiring optimization for high-frequency characteristics.

  • Integration Complexity: Challenges in maintaining signal integrity when integrated into SoC or packages.

Key Players

  • Murata Manufacturing Co., Ltd.: High-performance ISC for automotive and industrial applications.

  • Empower Semiconductor: Compact E-CAP ISC for mobile and IoT.

  • Skyworks Solutions Inc.: ISC optimized for RF and high-frequency applications.

  • Winbond Electronics Corporation: ISC with CUBE architecture for advanced packaging.

  • TSMC (Taiwan Semiconductor Manufacturing Company): ISC integration within high-performance packages.

  • Vishay Intertechnology: Reliable silicon capacitors for various applications.

Why Industries Are Shifting from MLCC to ISC

  1. Electrical Stability: Consistent capacitance under DC bias and temperature variations.

  2. Superior High-Frequency Performance: Reliable performance even at high frequencies.

  3. Miniaturization Potential: Ultra-thin form factor enabled by semiconductor processes.

  4. Enhanced Durability: Resistant to thermal changes and mechanical stress.

  5. Seamless Integration: Easily integrated within SoC and semiconductor packages.

Comparison: ISC vs MLCC

FeatureISCDTCMLCC
Electrical StabilityExcellentSuperiorLimited
High-FrequencyExcellentSuperiorLimited
MiniaturizationUltra-thinUltra-compactSize restricted
DurabilityExcellentExcellentProne to cracks
IntegrationSoC, PackageSoCLimited

Key Application Areas

ISC and DTC are rapidly adopted in 5G communication, AI servers, medical devices, aerospace, mobile devices, and server systems, positioning them as essential technologies replacing traditional MLCC.

Conclusion

ISC and DTC are overcoming the limitations of conventional MLCC, becoming essential in high-performance, miniaturized, and high-frequency applications. Leading companies are investing in ISC and DTC development, aiming for competitive advantage in the rapidly evolving market.

Popular posts from this blog

Qualcomm : Beyond Mobile AP – Expanding into PC, Automotive, and Edge AI

Image
  [Posting: 2025.04.22] The company Qualcomm , which became widely known in the early 2000s through the licensing of CDMA (Code Division Multiple Access) technology , played a pivotal role in the mobile era by beginning to equip Android phones with its Snapdragon APs  (Application Processor) . Today, Qualcomm is expanding its market presence by replacing Intel Core processors in PCs with Snapdragon X Elite , and is also entering the fields of Edge AI and automotive applications . It is currently the sole supplier of APs for the Galaxy S25 series , highlighting its strong position in the premium market . However, as Taiwan’s MediaTek is steadily capturing market share not only in the premium segment but also in the mid- and low-end markets , it remains to be seen whether Qualcomm has the technological capabilities to maintain its solid footing in the Android mobile space. 📊 [Semiconductor] Qualcomm Company Analysis – 2024 Earnings, Product Line, Foundry Partners, and Sal...
Read more

Infineon: The No. 1 Automotive Semiconductor Company — Standing Shoulder to Shoulder with STMicro and NXP

Image
  Infineon [Posting: 2025.05.05] Infineon, the No. 1 automotive semiconductor company in the world, forms a "top-three" system alongside NXP and STMicroelectronics . With its own in-house fabs, Infineon is vertically integrating its power semiconductor production , while also partnering with foundry TSMC to manufacture high-performance MCUs using 28nm + RRAM (Resistive RAM) technology —pursuing both internal and external manufacturing to drive revenue. Additionally, together with TSMC, Bosch, and NXP, Infineon is establishing ESMC (European Semiconductor Manufacturing Company) in Dresden, Germany , planning to begin production by 2027 using 12/16nm FinFET and 22/28nm CMOS process nodes . This represents a strategic initiative to expand in-vehicle semiconductor fab capacity within Europe. Focusing on automotive MCUs and power semiconductors , Infineon is aiming to secure the supply of core components such as controllers and power modules essential for future electric vehicle...
Read more

NXP: The World’s No.2 Automotive Chipmaker, Standing Shoulder to Shoulder with Infineon and STMicro

Image
  NXP NXP, the world’s second-largest automotive semiconductor company , was spun off from Philips’ semiconductor division in 2006 and now forms a core part of the automotive semiconductor ecosystem alongside Infineon, STMicro, TI, and Renesas. NXP is recognized for its strong technological capabilities in automotive SoCs and MCUs. While Infineon and STMicro operate their own fabrication facilities, NXP is a pure fabless company that collaborates primarily with foundries such as TSMC, Samsung Foundry, GlobalFoundries, and UMC. This means that even though it ranks second in revenue, NXP is considered a leader in this segment purely through its design capabilities. Automotive accounts for 56% of its revenue, followed by Industrial & IoT (18%) and Mobile (12%) . The company’s overall revenue and operating profit are likely to increase depending on how it balances revenue contributions between automotive and consumer/industrial segments. As the share of SoCs and MCUs in elect...
Read more