Next-Generation High-density Capacitors Replacing MLCC — the "Rice of Semiconductors": ISC (Integrated Silicon Capacitor) and DTC (Deep Trench Capacitor)
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high density capacitor : DTC and ISC type |
[Posting: 2025.05.22]
High-capacitance capacitors such as ISC (Integrated Silicon Capacitor) and DTC (Deep Trench Capacitor) differ in their structural approaches, but both are optimized for applications that demand large capacitance—such as mobile, server, medical, and RF devices. They are now considered next-generation alternatives to MLCCs (Multi-Layer Ceramic Capacitors), offering superior performance in terms of stability under DC bias and temperature variation, excellent high-frequency response, thin and compact form factors, and enhanced durability and reliability. As a result, the transition toward ISC (or DTC) is accelerating.
As of 2025, ISC mass production at a density of 2000nF/mm² is underway, and by 2026–2027, it is expected to support capacitance levels of around 4000nF/mm². This will likely lead to growing demand for high-capacitance components and magnetic inductors required for voltage regulators in mobile and server platforms (Vtypical: 1.35V).
Currently, discrete capacitors dominate the market. In server applications, however, ISC is expected to be embedded within interposers, while in mobile devices, high-capacitance discrete components will continue to be used. As independent power supply to individual cores and stable voltage delivery become more critical—especially for achieving low power operation—these components are increasingly being recognized as essential for next-generation system architectures.
Integrated Silicon Capacitor (ISC) and DTC vs MLCC - Comprehensive Analysis (2025)
Overview and Market Analysis of ISC and DTC
Integrated Silicon Capacitors (ISC) and Direct Silicon Capacitors (DTC) are advanced capacitor technologies playing a crucial role in modern electronic devices. ISC is a high-density capacitor fabricated using semiconductor processes, characterized by excellent electrical stability and miniaturization. DTC, as an evolution of ISC, directly forms on the silicon substrate, offering ultra-fast response and superior high-frequency performance.
Technical Characteristics of ISC and DTC
ISC (Integrated Silicon Capacitor)
Manufacturing Process: Precision patterning on silicon substrate using semiconductor processes (Photolithography, Etching).
Electrical Properties: Maintains stable capacitance under DC bias and temperature variations.
Miniaturization: Ultra-thin (below 0.1mm) structure possible.
High-Frequency Performance: Optimal for high-frequency applications, including 5G communication, high-frequency filters, and AI servers.
DTC (Direct Silicon Capacitor)
Enhanced High-Frequency Performance: Formed directly on silicon for faster response.
Ultra-Compact and Integrated: Can be directly integrated into semiconductor packages.
Application Areas: RF modules, 5G communication, high-speed data transmission, satellite communications.
Technical Complexity
ISC: Requires advanced semiconductor processing (Photolithography, Etching) for precise manufacturing.
DTC: Direct patterning on silicon surface, requiring optimization for high-frequency characteristics.
Integration Complexity: Challenges in maintaining signal integrity when integrated into SoC or packages.
Key Players
Murata Manufacturing Co., Ltd.: High-performance ISC for automotive and industrial applications.
Empower Semiconductor: Compact E-CAP ISC for mobile and IoT.
Skyworks Solutions Inc.: ISC optimized for RF and high-frequency applications.
Winbond Electronics Corporation: ISC with CUBE architecture for advanced packaging.
TSMC (Taiwan Semiconductor Manufacturing Company): ISC integration within high-performance packages.
Vishay Intertechnology: Reliable silicon capacitors for various applications.
Why Industries Are Shifting from MLCC to ISC
Electrical Stability: Consistent capacitance under DC bias and temperature variations.
Superior High-Frequency Performance: Reliable performance even at high frequencies.
Miniaturization Potential: Ultra-thin form factor enabled by semiconductor processes.
Enhanced Durability: Resistant to thermal changes and mechanical stress.
Seamless Integration: Easily integrated within SoC and semiconductor packages.
Comparison: ISC vs MLCC
Feature | ISC | DTC | MLCC |
---|---|---|---|
Electrical Stability | Excellent | Superior | Limited |
High-Frequency | Excellent | Superior | Limited |
Miniaturization | Ultra-thin | Ultra-compact | Size restricted |
Durability | Excellent | Excellent | Prone to cracks |
Integration | SoC, Package | SoC | Limited |
Key Application Areas
ISC and DTC are rapidly adopted in 5G communication, AI servers, medical devices, aerospace, mobile devices, and server systems, positioning them as essential technologies replacing traditional MLCC.
Conclusion
ISC and DTC are overcoming the limitations of conventional MLCC, becoming essential in high-performance, miniaturized, and high-frequency applications. Leading companies are investing in ISC and DTC development, aiming for competitive advantage in the rapidly evolving market.