Siliconspot

  high density capacitor : DTC and ISC type [Posting: 2025.05.22] High-capacitance capacitors such as ISC (Integrated Silicon Capacitor) and DTC (Deep Trench Capacitor) differ in their structural approaches, but both are optimized for applications that demand large capacitance—such as mobile, server, medical, and RF devices . They are now considered next-generation alternatives to MLCCs (Multi-Layer Ceramic Capacitors), offering superior performance in terms of stability under DC bias and temperature variation, excellent high-frequency response, thin and compact form factors, and enhanced durability and reliability. As a result, the transition toward ISC (or DTC) is accelerating . As of 2025, ISC mass production at a density of 2000nF/mm² is underway, and by 2026–2027, it is expected to support capacitance levels of around 4000nF/mm². This will likely lead to growing demand for high-capacitance components and magnetic inductors required for voltage regulators in mobile and server...

  Ascend 910 from Huawei [Posting: 2025.05.19] US-China Trade War in 2025: Huawei Sanctions Remain Amid Semiconductor Dominance Battle Despite a temporary easing of US tariffs on China as of May 2025, sanctions against Huawei—one of the primary targets in the semiconductor dominance war—remain strictly enforced. Huawei’s Ascend AI processors are high-performance chips independently developed by Huawei, with the Ascend 910D model aiming to outperform Nvidia’s H100, and the Ascend 920 model set for mass production in late 2025 using a 6nm process and HBM3 technology, delivering over 900 TFLOPs of computing power. The United States maintains these sanctions under the justification of: Potential military use of Ascend chips in China’s military technology. Threats to US semiconductor technology leadership in the global AI market. Concerns over data security , with fears of information leaks to the Chinese government. While the US has temporarily eased tariffs in the trade wa...

  TI (Texas Instruments) [Posting: 25.05.13] Texas Instruments (TI) , one of the leading semiconductor companies in the United States, specializes in manufacturing products for analog and automotive applications . The company operates its own IDM (Integrated Device Manufacturing) facilities with 200mm and 300mm FABs and collaborates with foundry partner UMC to enhance production capacity. TI's revenue distribution is as follows: Industrial (35%), Automotive (25%), and Personal Electronics (20%) . The company is well-known for its expertise in analog products and consistently maintains an operating margin of around 40% . With its 200mm and 300mm FABs, TI has the infrastructure to handle massive production volumes efficiently. Texas Instruments (TI) - Growth and Strategy of a Global Semiconductor Leader 🏢 Company Overview and History Texas Instruments (TI) is a global semiconductor and electronic components manufacturer founded in 1930 in Dallas, Texas, USA. Initially focused on ...

  Intel [Posting: 2025.05.11] Once the undisputed leader in semiconductor sales and market capitalization, Intel has faced a dramatic shift, recording a massive $11.6 billion loss in 2024 as it struggled to adapt to the new paradigm shift from PC to AI . While other fabless companies leveraged TSMC's advanced processes to produce competitive chips, Intel relied on its own in-house fabrication, failing to maintain technological superiority . As a result, the company lost significant market share in the PC segment to competitors like AMD . Furthermore, its transition to cloud and AI technology was slow, leaving it as a latecomer in the rapidly evolving market. Intel is attempting to make a technological transformation through Intel Foundry Service (IFS), but it must narrow the technological gap with TSMC and Samsung Foundry. Even if it develops advanced technologies, the challenge of achieving high yield rates remains. Intel aims to leverage its Gate-All-Around (GAA) process technol...

  Silicon photonics collaboration : NVIDIA/TSMC [Posting: 25.05.08] NVIDIA and TSMC are collaborating on the development of silicon photonics technology to transition data center communication from rack-to-rack copper wire connections to optical communication. Currently, they are utilizing a pluggable form factor , where boards are connected via fiber optics in a pluggable configuration. However, they plan to further integrate this technology by implementing Co-Packaged Optics (CPO) for optical communication within Multi-Chip Modules (MCM) , which will be applied to the Rubin GPU scheduled for release in 2026 . This approach is expected to enable data centers to achieve low power consumption and high bandwidth at terabits-per-second levels. Although there are several challenges to overcome—such as further advancements in CPO technology, development of Electric ICs (EIC), Photonic ICs (PIC), and 3D packaging using Hybrid Copper Bonding (HCB) —there are high expectations for the C...

  Infineon [Posting: 2025.05.05] Infineon, the No. 1 automotive semiconductor company in the world, forms a "top-three" system alongside NXP and STMicroelectronics . With its own in-house fabs, Infineon is vertically integrating its power semiconductor production , while also partnering with foundry TSMC to manufacture high-performance MCUs using 28nm + RRAM (Resistive RAM) technology —pursuing both internal and external manufacturing to drive revenue. Additionally, together with TSMC, Bosch, and NXP, Infineon is establishing ESMC (European Semiconductor Manufacturing Company) in Dresden, Germany , planning to begin production by 2027 using 12/16nm FinFET and 22/28nm CMOS process nodes . This represents a strategic initiative to expand in-vehicle semiconductor fab capacity within Europe. Focusing on automotive MCUs and power semiconductors , Infineon is aiming to secure the supply of core components such as controllers and power modules essential for future electric vehicle...

  NXP NXP, the world’s second-largest automotive semiconductor company , was spun off from Philips’ semiconductor division in 2006 and now forms a core part of the automotive semiconductor ecosystem alongside Infineon, STMicro, TI, and Renesas. NXP is recognized for its strong technological capabilities in automotive SoCs and MCUs. While Infineon and STMicro operate their own fabrication facilities, NXP is a pure fabless company that collaborates primarily with foundries such as TSMC, Samsung Foundry, GlobalFoundries, and UMC. This means that even though it ranks second in revenue, NXP is considered a leader in this segment purely through its design capabilities. Automotive accounts for 56% of its revenue, followed by Industrial & IoT (18%) and Mobile (12%) . The company’s overall revenue and operating profit are likely to increase depending on how it balances revenue contributions between automotive and consumer/industrial segments. As the share of SoCs and MCUs in elect...