GlobalFoundries : Headquartered in the U.S., Focuses on Legacy Nodes

 


[Posting: April 21, 2025]

In the semiconductor foundry industry, there's a clear pecking order — with the top player making massive profits, while second and third place companies fluctuate between profits and losses. Among them, one company that could be described (albeit ambiguously) as the pride of Singapore’s semiconductor scene — though it's technically headquartered in the U.S. and has fabs in Germany and the U.S. — is GlobalFoundries.

Going back in time, AMD spun off its semiconductor manufacturing division, which initially had a 40nm-class fab in Dresden, Germany. In 2009, ATIC (Advanced Technology Investment Company), an investment arm of Abu Dhabi’s sovereign wealth fund — a major representative of “oil money” — acquired Chartered Semiconductor, expanding the company with both 200mm and 300mm wafer lines.

Although GlobalFoundries initially attempted to keep pace with TSMC and Samsung Foundry in developing 7nm FinFET-based processes, it ultimately halted these efforts due to the massive investment required. Instead, it chose to focus on legacy nodes (10nm and above). While it doesn't generate enormous profits, the company has carved out a niche in specialty processes, securing a respectable position in the market.

I hope the following information will serve as a useful reference.

GlobalFoundries – Company Overview

GlobalFoundries is a global semiconductor foundry established in 2009, playing a critical role in semiconductor manufacturing. It offers essential semiconductor solutions across a wide range of industries and continues to grow through innovative technologies. This post covers the company’s founding year, major milestones, manufacturing facilities, IPO information, and corporate summary.

🔹 Key Milestones of GlobalFoundries

  • March 2009: Founded as a spin-off of AMD’s semiconductor manufacturing division

  • December 2009: Acquired Chartered Semiconductor, expanding its manufacturing presence in Singapore

  • October 2014: Acquired IBM’s microelectronics division, gaining major manufacturing facilities in New York

  • August 2018: Announced the discontinuation of 7nm process development, shifting focus to mature nodes

  • October 2021: Listed on NASDAQ via IPO

  • September 2023: Signed a 10-year contract with the U.S. Department of Defense to expand secure semiconductor supply

  • February 2024: Received $1.5 billion in funding under the CHIPS Act to expand Malta and Burlington fabs in New York

🏭 GlobalFoundries Manufacturing Facilities

  • United States:

    • Malta, NY (Fab 8)

    • Burlington, VT (formerly IBM Fab 9)

    • East Fishkill, NY (formerly IBM Fab 10)

  • Germany:

    • Dresden (Fab 1)

  • Singapore:

    • Woodlands (Fab 2, 3, 5, 6, 7)

    • Tampines (FAB 3E, sold to VIS)

📊 Company Summary (as of 2024)

  • Established: 2009

  • Headquarters: Malta, New York, USA

  • Listed: 2021

  • Stock Exchange: NASDAQ

  • Ticker Symbol: GFS

  • Major Shareholder: Mubadala Investment Company (UAE Sovereign Wealth Fund) — owns 82%, originally ATIC (home turf of "Mansour")

  • Employees: ~13,000

📈 GlobalFoundries 2024 Financial Performance

  • Revenue: ~$6.75 billion (decline compared to the previous year)

  • Operating Loss: ~$214 million

  • Non-IFRS Operating Profit: ~$920 million

Despite operational losses under GAAP, GlobalFoundries remains a major player in the global semiconductor industry.



🌐 Market Share

GlobalFoundries holds approximately 7–8% of the global foundry market. Key competitors include TSMC, Samsung, UMC, and SMIC. The company maintains strong positions in automotive, mobile, and IoT sectors.

🏢 Global FAB Overview

  • U.S.: Key production in Malta (NY) and Burlington (VT)

  • Europe: 300mm wafer production in Dresden, Germany

  • Asia: Facilities in Singapore and Chengdu, China

    • Singapore serves as a center for advanced process technology

    • 300mm Fabs: FAB 6, 7

    • 200mm Fabs: FAB 2, 3, 5

🔬 Silicon Photonics Technology

GlobalFoundries supports high-performance communication and sensor applications via its Silicon Photonics technology. It provides its proprietary “FOTONIX” solution using a 45nm RF-SOI process.

Key Features:

  • Integration of photonic ICs and electrical CMOS ICs

  • High-speed data transmission with low power consumption

  • Optimized for data centers, fiber optics, and sensor applications

⚙️ BCD (Bipolar-CMOS-DMOS) Process Technology

BCD technology is crucial for power management, automotive systems, and industrial control applications. It integrates multiple transistor types to deliver high-performance and efficient solutions.

📌 Key Features of BCD Technology:

  • Integration of Bipolar, CMOS, and DMOS transistors

  • Suitable for power management and motor control systems

  • Capable of handling high voltage and high current

📌 BCDLite® Process:

  • Supports voltage ranges from 5V to 65V

  • Optimized for automotive and sensor applications

  • Offers embedded flash memory options

🛠️ BCD Technology Roadmap

GlobalFoundries is advancing its BCD process with the following goals:

  • Process Node Scaling: Transition from 130nm/180nm to 55nm nodes

  • Voltage Range Expansion: Development of transistors supporting higher voltages

  • Automotive Certification: Introduction of Auto Grade 1 for high-temperature conditions

  • E-Flash Support: Expansion into applications requiring embedded flash memory

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