Rapidus : Japan’s Foundry developing 2nm GAA, Aiming for Mass Production in 2027!! Will They Succeed?
[Posting: April 21, 2025]
Japan's Semiconductor Industry Finally Bares Its Teeth
Eight major corporations—Toyota, Sony, Denso, NTT, NEC, SoftBank, MUFG Bank, and Kioxia—have joined forces to invest in the advanced 2nm node (GAA: Gate All Around) technology, establishing a new foundry company called Rapidus with the goal of beginning mass production by 2027. While TSMC and Samsung Foundry are also advancing their 2nm GAA technologies, Japan is taking a bold step similar to Intel Foundry. However, securing high yield in mass production remains a major challenge. Although Rapidus has announced a technological partnership with IBM for 2nm development, it remains uncertain whether IBM—primarily a research-focused entity—can deliver scalable production technologies. Japan is also aiming for 1nm mass production by 2030, but whether key milestones in 2nm development will be achieved remains a crucial point to watch.
๐ฏ๐ต [Semiconductors] Japan’s Comeback with Rapidus: Targeting 2nm Foundry Leadership by 2027
Posted: April 16, 2025 | By: Semiconductor Industry Analyst
Japan is back in the game. With the establishment of Rapidus Corporation, the Japanese semiconductor industry is aiming to reenter the global top-tier race by developing 2nm GAA (Gate-All-Around) technology, targeting mass production by 2027. Backed by corporate giants and government funding, Rapidus represents Japan’s strategic pivot toward regaining semiconductor sovereignty.
๐ง What is Rapidus? Japan’s National Foundry Ambition
-
Company Name: Rapidus Corporation
-
Established: August 10, 2022
-
Headquarters: Chiyoda-ku, Tokyo, Japan
-
CEO: Atsuyoshi Koike
-
Main Investors: Toyota, Sony, Denso, NTT, NEC, SoftBank, Kioxia, MUFG Bank
-
Primary Goal: Mass production of 2nm logic semiconductors using GAA transistor architecture within Japan
This marks a direct challenge to industry leaders TSMC and Samsung Foundry, who are also developing GAA technologies. Rapidus aims to be Japan’s answer to global semiconductor shortages and rising geopolitical supply chain risks.
๐ฐ️ Key Milestones and Historical Timeline
Date | Milestone |
---|---|
Dec 2022 | Announced technology partnership with IBM for 2nm GAA development |
Sep 2023 | Broke ground on Chitose fab in Hokkaido |
Apr 2024 | Opened U.S. design subsidiary "Rapidus Design Solutions" in Silicon Valley |
Jul 2025 (Planned) | First 2nm prototype chip shipment |
2027 (Planned) | Start of mass production for 2nm semiconductors |
๐ฐ Financial Overview: Massive Investment and Government Support
-
Initial Investment: ¥7.3 billion (~$73 million USD)
-
Japanese Government Support: Over ¥1 trillion (~$6.5 billion USD) pledged through 2025
-
Future Investment Plan: Additional ¥5 trillion (~$36 billion USD) over the next decade
Japan’s public-private partnership model is fueling Rapidus to compete with the world’s most advanced foundries.
๐ญ Production Capacity and Fab Status
-
Fab Location: Chitose City, Hokkaido
-
Planned Output: 30,000 to 40,000 wafers/month
-
Key Equipment: ASML EUV Lithography system ‘NXE:3800E’
-
Timeline:
-
2025: Pilot production begins
-
2027: Commercial volume production begins
-
๐ง Core Technologies and Application Areas
๐ฌ Key Technologies
-
2nm GAA (Gate-All-Around) transistor fabrication
-
Raads: AI-based chip design automation system
-
DMCO: Design-Manufacturing Co-Optimization Platform
-
RUMS: Rapid and Unified Manufacturing Services
๐ Application Fields
-
AI and High-Performance Computing (HPC)
-
Automotive chips
-
Next-gen communication and power management ICs
๐ค Strategic Partners
-
IBM, imec (Belgium), Tenstorrent (Canada)
-
Ongoing Negotiations: Apple, Google, Meta, Amazon, Microsoft
๐ Fab Utilization and Business Model
-
Production Strategy:
-
Small-batch, multi-variant production instead of high-volume fabs
-
Focused on customized semiconductor solutions for niche markets
-
-
Utilization Goal: Over 80% fab utilization by 2027
-
Integrated Model: In-house design-to-manufacture for fast production cycles
๐ผ Talent Strategy and Compensation
-
Entry-Level Salary: Around ¥10 million/year (~$90,000 USD) – significantly above industry average
-
Talent Pipeline Strategy:
-
Attract global talent with competitive compensation
-
Partnering with Tenstorrent for RISC-V AI semiconductor design training programs
-
๐ Final Analysis: Can Japan Catch Up?
Rapidus is a national project fueled by Japan’s top industrial names and the government’s full support. While challenges remain—particularly in yield improvement and mass production scalability—its 2nm GAA roadmap, IBM collaboration, and strategic fab investments make it a formidable contender.
If it successfully achieves 2nm mass production by 2027, Rapidus could:
-
Signal a renaissance in Japan’s semiconductor industry
-
Strengthen global supply chain diversification
-
Offer an alternative to TSMC-Samsung-Intel triopoly
๐ Outlook: Toward 2030 and Beyond
-
Next Milestone: Targeting 1nm semiconductor mass production by 2030
-
Key Watchpoint: Can Rapidus hit 2nm milestone in 2027 and attract global clients?
Japan is betting big on Rapidus—and the world is watching.